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| Kyocera develops and provides a wide variety of ceramics for package applications. Material properties of typical multilayer ceramics are as follows: |
| CERAMIC MATERIAL OPTIONS |
ELECTRICAL |
THERMAL |
MECHANICAL |
CONDUCTOR MATERIAL |
| Dielectric Constant |
Dissipation Factor
(x10E-4) |
CTE(ppm/K)
(RT-400oC)
|
Thermal Conductivity
(W/mK) |
Flexural Strength
(MPa) |
Young's Modulus of Elasticity
(GPa) |
| 1MHz |
2 GHz |
1MHz |
2 GHz |
| Al2O3 |
A473 |
9.1 |
8.5 |
5 |
10 |
6.9 |
18 |
400 |
270 |
W, Mo |
| A440 |
9.8 |
_ |
24 |
_ |
7.1 |
14 |
400 |
310 |
W, Mo |
| A443 |
9.6 |
_ |
5 |
_ |
6.9 |
18 |
460 |
310 |
W, Mo |
| AO600 |
9.0 |
8.8 |
10 |
21 |
7.2 |
15 |
400 |
260 |
CuW |
| AO700 |
9.4 |
9.2 |
6 |
6 |
7.2 |
21 |
620 |
315 |
Mo |
| AlN |
AN242 |
8.7 |
8.6 |
1 |
170 |
4.7 |
150 |
400 |
320 |
W |
LTCC |
GL940 |
_ |
18.7 |
_ |
2.5 |
10.7 |
3.5 |
220 |
188 |
Ag |
| GL950 |
_ |
9.4 |
_ |
14 |
8.5 |
4.1 |
400 |
173 |
Ag |
| GL330 |
7.8 |
7.7 |
4 |
5 |
8.2 |
4.3 |
400 |
178 |
Cu |
| GL570 |
5.6 |
5.7 |
3 |
7 |
3.4 |
2.8 |
200 |
128 |
Cu |
| GL771 |
5.3 |
5.2 |
8 |
36 |
12.3 |
2.0 |
170 |
74 |
Cu |
|
| Note: Material characteristics listed above are typical values. Values may change upon further improvement or modification of materials and manufacturing processes. |
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Semiconductor Components |
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