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Component Assembly Technology for Ceramic ECU

Ceramic electronic control unit (ECU) modules depend on high-density component assembly technologies. Kyocera, the world leader in ceramic multilayer substrates, provides state-of-the-art assembly services using the industry's most advanced resources and technologies.

Product Outline

Features

·	Reliability design technologies
·	Surface mounting technologies
·	Bare-chip mounting technologies

Applications

·	ECUs for fuel injection
·	ECUs for automatic transmissions
·	ECUs for electronic power steering
·	ECUs for starters / alternators
·	DC-DC converters

Ceramic ECU Assembly Technologies

1.	Reliability design technologies
	(1)	Simulation technologies
		Mechanical strength, life time, vibration, heat dissipation, circuit, radio frequencies
	(2)	For automotive environment
		Heat durability, moisture resistance, vibration resistance, EMC

2.	Surface mounting technologies
	(1)	Adopt Pb-free solder (Sn-Ag-Cu system)
	(2)	Design technologies for high reliability assembly
		Optimum pad design, optimum solder volume
	(3)	Sealing
		·Epoxy seal for gold wire, Silicone gel glob top for Al wire
		·Underfill by epoxy resin, etc.

3.	Bare-chip mounting technologies
	(1)	Bare-chip mounting without heat spreader
		Solder pre-form, silver-filled epoxy paste
	(2)	Wire bonding
		Au wire: 20 micron to 50 micron dia. in heating condition
		Al wire: 20 micron to 500 micron dia, in room temperature
	(3)	Flip-chip solder bumping

Evaluation Results of Pb-free Solder

Cumulative Break Probability vs. Thermal Cycles		Fatigue Fracture of Solder Materials